AI chip demonstrators for EU compute infrastructure
Europese Commissie
Europese fabless-bedrijven en systeempartners die AI-chipprototypes willen ontwikkelen en valideren.
Ook bekend als DIGITAL-JU-CHIPS-2026-AI1-SG
Waar is deze subsidie voor?
Expected Outcome: The expected outcomes of this topic are : Functional demonstrators of working AI chip prototypes (PCB-level) designed by EU fabless companies and physically integrated with their system partners. Validation of AI chip solutions on a common EU evaluation platform (provided by the Topic X.B consortium), delivering comparative evidence on key performance indicators. A shortlist of European AI chip solutions awarded the AI Compute Excellence label and qualified to proceed to full rack development under Topic X.A2.
Voor wie is het bedoeld?
Europese fabless-bedrijven en systeempartners die AI-chipprototypes willen ontwikkelen en valideren.
Waarvoor kunt u subsidie krijgen?
- AI-chip demonstrators
- Europese chipinnovatie
- AI-compute infrastructuur
- Chip-prototypen validatie
Kom ik in aanmerking?
De eisen uit de regeling. Uw situatie bepaalt of u voldoet; dit is geen beschikking.
Zo vraagt u aan
Zoals beschreven door de verstrekker. Onvolledig? Controleer altijd het officiële loket.
Naar het aanvraagloketOpenstellingen en rondes
- Start
- 7 jul 2026
- Sluit
- 23 sep 2026
- Budget
- -
- Verdeling
- Tender
Bronnen en actualiteit
“Expected Outcome: The expected outcomes of this topic are : Functional demonstrators of working AI chip prototypes (PCB-level) designed by EU fabless companies and physically integrated with their system partners. Validation of AI chip solutions on a common EU evaluation platform (provided by the To…”
Toon brontekst
AI chip demonstrators for EU compute infrastructure Topic: DIGITAL-JU-CHIPS-2026-AI1-SG Call: DIGITAL-JU-CHIPS-2026-AI1-SG — DIGITAL-JU-CHIPS-2026-AI1-SG Programma: Digital Europe Programme (2021 - 2027) == Beschrijving == Expected Outcome: The expected outcomes of this topic are : Functional demonstrators of working AI chip prototypes (PCB-level) designed by EU fabless companies and physically integrated with their system partners. Validation of AI chip solutions on a common EU evaluation platform (provided by the Topic X.B consortium), delivering comparative evidence on key performance indicators. A shortlist of European AI chip solutions awarded the AI Compute Excellence label and qualified to proceed to full rack development under Topic X.A2. == Voorwaarden (topic conditions) == "> Conditions 1. Admissibility conditions: Proposal page limit and layout 1. Admissibility conditions: Proposal page limit and layout Proposal page limits and layout: detailed in Part B of the Application Form, which you can access from the Call documents section on the Chips JU website's Call page The following information are all described in the Appendix 8 of the Chips JU Workprogramme 2. Eligible countries 3. Other eligibility conditions 4. Financial and operational capacity and exclusion 5a. Evaluation and award: Submission and evaluation processes 5b. Evaluation and award: Award criteria, scoring and thresholds 5c. Evaluation and award: Indicative timeline for evaluation and grant agreement 6. Legal and financial set-up of the grants Specific Call Documents Ownership Control Declaration form template National Budgets Table template (xls) Guide for applicants - DIGITAL-JU-CHIPS-2026-AI1-SG Template of Application Form - DIGITAL-JU-CHIPS-2026-AI1-SG Template of Evaluation Form - DIGITAL-JU-CHIPS-2026-AI1-SG General Call Documents Chips JU Multiannual Work Programme PAB decision on the evaluation and selection procedures related to Calls for Proposals Rules for legal entity validation, LEAR appointment, financial capacity and ownership control assessment Annotated Model Grant Agreement for EU Funding Programmes 2021-2027 Appendix 8 of Work Programme - Chips for Europe Initiative Call document and annexes: Model Grant Agreements (MGA) DEP MGA Additional documents: DEP Regulation 2021/964 EU Financial Regulation 2024/2509 EU Grants AGA — Annotated Model Grant Agreement Funding & Tenders Portal Online Manual Funding & Tenders Portal Terms and Conditions Funding & Tenders Portal Privacy Statement
Deze informatie is geautomatiseerd samengesteld uit officiële bronnen en kan onvolledig zijn. Controleer details bij de verstrekker. Elk hard feit toont een citaat uit de brontekst.